Sensor device

ABSTRACT

A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; a resin part covering the sensor component; and mounting leads including a one-end part coupled to one first connection terminal in the resin part so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. application Ser. No.12/637,792 filed Dec. 15, 2009, which claims priority to Japanese PatentApplication No. 2008-320185, filed Dec. 16, 2008 and Japanese PatentApplication No. 2008-320186, filed Dec. 16, 2008, both of which areexpressly incorporated by reference herein.

BACKGROUND

1. Technical Field

The present invention relates to a sensor device, and in particular, asensor device which is preferable in a case where a detection directionof a detection axis of a sensor element that detects an angular velocityand acceleration is tilted.

2. Related Art

In navigation systems installed in a vehicle such as an automobile, anangular difference may be produced between a mounting surface of asubstrate of an electronic apparatus and a detection direction of adetection axis of a sensor element mounted on a sensor device to bemounted on the substrate. In this case, the angular difference has anaffect on angular velocities and signals of acceleration, appearing as adecrease in detection sensitivity and a detection error. Conventionally,software corrects such influence of the angular difference. However, alarge angular difference between the detection axis and the actualrotation axis or that between the detection axis and a direction towhich the acceleration to be added exceeds the correctable range of thesoftware. This makes it difficult to detect the angular velocity and theacceleration.

In view of such a problem, a sensor device has been proposed in whichthe detection axis corresponds to the detection axis of the angularvelocity and the acceleration by changing the mounting angle of thesensor device with respect to the mounting substrate.

JP-A-2008-96420 is a first example of related art. For example, in thefirst example, the inventor has proposed a sensor device that includesmounting leads formed by being folded so as to maintain a tilted stateof a sensor component, into which a sensor element is built, withrespect to the mounting substrate, and the sensor component mounted onthe mounting leads is covered by a resin. The sensor device having sucha configuration allows suppressing the decrease in detection sensitivityand the detection error caused by the angular difference.

JP-A-2008-51629 is a second example of related art. In the secondexample, a sensor device capable of multi-axis detection is disclosed.The second example shows a technique for changing the detectiondirection of the detection axis of the sensor element by fixing the sidesurface of the sensor device, into which the sensor element is built, toa base substrate. With this configuration, it is possible to turn themounting angle of the sensor device by 90°. As a result, it is possibleto detect the angular velocity and the acceleration that cannot bedetected by a sensor element mounted parallel to the base substrate.

According to the sensor device disclosed in the first example, thedetection axis of the sensor element can be tilted while achieving themounting stability of the sensor device. Therefore, it is possible toreduce the risk that the detection error between the detection directionof the angular velocity and the acceleration and the actual angleexceeds the correctable range of the software. However, in the sensordevice disclosed in the first example, the mounting angle of the sensorelement is determined by a bending condition of the mounting leads, sothat a variation in the mounting angle of the sensor element may cause avariation in the bending angle of the mounting leads. In addition, whenthe tilt angle of the sensor element is increased, the mounting leadsare exposed to the top of a resin part. This makes it difficult tohandle the sensor device in transferring such as chucking.

The technique disclosed in the second example cannot meet particularrequirements of the mounting angle since there are only two choices (0°or 90°) for the mounting angle of the sensor element. Further, it isrequired to design and manufacture a dedicated base substrate for therelocation of wiring, causing an increase of the manufacturing cost.

Further, it is necessary to provide a test-write terminal to the sensordevice for testing the sensor element and the like at the time ofmanufacturing or for writing data into an IC that controls the sensorelement. However, in a case where the test-write terminal has the sameconfiguration as that of the mounting terminal, the test-write terminalmay be short-circuited by the inadvertent contact with other electrodes,electronic components, and the like.

SUMMARY

An advantage of the present invention is to provide a sensor devicewhich is capable of determining an angle of a mount surface of a sensorelement with respect to a mounting surface (a mounting substrate) of thesensor device with high accuracy. The invention further provides asensor device in which the mounting angle of the sensor element iseasily angled to have a predetermined angle, the sensor device in whichan arrangement of mounting leads do not become complex, and the sensordevice that does not require a dedicated substrate and the like.Furthermore, the invention is to prevent short-circuits of a test-writeterminal with other electrodes, electronic components, and the like.

The invention intends to solve at least part of the above problem, andcan be realized by the following aspects of the invention.

According to an aspect of the invention, a sensor device includes: asensor component including a package, connection terminals having firstterminals on a terminal forming surface of the package, and a sensorelement that has a detection axis and is housed in the package; a resinpart covering the sensor component; and mounting leads, each of themounting leads including, a one-end part formed by being folded so as tobe coupled to one of the first connection terminals in the resin part sothat a main surface of the one-end part and a main surface of the one ofthe first connection terminals face each other, an intermediate partextending toward a mounting surface of the sensor device from theone-end part, and an other-end part formed by being folded so as to beexternally exposed from the resin part. In the device, the sensorcomponent is tilted or orthogonal with respect to the mounting surface,and the connection terminals are provided along one of the sides formingan outline of the terminal forming surface, the one side being tilted ororthogonal with respect to the mounting surface.

According to the aspect of the invention, since it is possible to reducethe influence on an angle θ formed by the mounting substrate and asensor element mounting surface (the terminal forming surface) due to avariation in the bending angle of the mounting leads, the angle θ can bedefined with high accuracy. Even if the angle is increased, thearrangement of the mounting leads does not become complex. Further, thebase substrate and the like for mounting the sensor element areunnecessary by the use of the mounting leads.

In the sensor device, the terminal forming surface of the sensorcomponent may be orthogonal to the mounting surface of the sensordevice, and the connection terminals may be provided along the one sideof the outline of the terminal forming surface, the one side beingorthogonal to the mounting surface.

With this configuration, since it is possible to eliminate the influenceon the angle θ formed by the mounting substrate and the sensor elementmounting surface (the terminal forming surface) due to the variation inthe bending angle of the mounting lead, the angle θ can be defined withhigh accuracy. Further, the routing of the leading lead does not becomecomplex.

In the sensor device, the intermediate part may include an angled part.

With this configuration, the tilt (the angle θ) of the sensor device isdetermined by a planar shape of the intermediate part of the mountinglead. As a result, the angle θ can be defined with high accuracycompared to related art configuration in which the angle θ is determinedby the bending angle of the mounting lead.

In the sensor device, a planar shape of the intermediate part may be anarch shape.

With this structure, the angle θ is determined by determining a lengthof the intermediate part of the mounting lead.

In the sensor device, the other-end parts of the mounting leads may bebent to a side of one main surface and a side of the other main surfaceof the mounting lead.

This configuration allows increasing an area of the mounting surface. Asa result, it is possible to improve the stability when the sensor deviceis placed to the mounting substrate and the like.

In the sensor device, the other-end parts of the mounting leads adjacentto each other are alternately bent toward the one main surface and theother main surface of the mounting lead.

This configuration allows increasing a position of the other-end part ofthe mounting lead, i.e., a space between the mounting terminals of thesensor device, thereby preventing short-circuits between the mountingterminals.

The sensor device may further include test-write leads. In the device,the connection terminals may include second connection terminal. Each ofthe test-write leads may includes: an one-end part coupled to one of thesecond connection terminal so that a main surface of the one-end partand a main surface of the second connection terminal face each other; anintermediate part that is laid out on the terminal forming surface andexternally extended from the resin part so as to straddle a sideadjacent to the one side of the terminal forming surface; and aother-end part outwardly exposed from the resin part.

This configuration allows preventing short circuits of a test-writeterminal with other electrodes, electronic components, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1A is a front view and FIG. 1B is a back view of a sensor deviceaccording to a first embodiment of the invention.

FIG. 2A is a right side view and FIG. 2B is a bottom view of the sensordevice according to the first embodiment.

FIG. 3A is a sectional view and FIG. 3B is a bottom view of a gyrosensor adopted in the first embodiment.

FIG. 4 is a diagram showing a configuration of a quartz crystalresonator element adopted in the first embodiment.

FIG. 5 is a diagram showing a configuration of a support substrateadopted in the first embodiment.

FIG. 6 is a diagram showing a configuration of a lead frame unit adoptedin the sensor device according to the first embodiment of the invention.

FIG. 7 is a diagram showing a state in which the gyro sensor is bondedto the lead frame unit.

FIG. 8 is a diagram showing the lead frame unit, to which the gyrosensor is bonded, from a side of a terminal forming surface.

FIG. 9 is a diagram showing a state in which the gyro sensor bonded tothe lead frame unit is put into a die for forming a resin part.

FIG. 10 is a diagram showing a state of the sensor device after theresin part is formed and before cutting a frame.

FIGS. 11A and 11B show a mounting state of the gyro sensor and a stateof a tilt of a detection axis. FIG. 11A is a case where an angle θformed by the terminal forming surface and a mounting surface is 0° andFIG. 11B shows a case where the angle θ is 90°.

FIG. 12 is a diagram showing a first modification of the sensor deviceaccording to the first embodiment.

FIG. 13 is a diagram showing a configuration of the sensor deviceaccording to a second embodiment.

FIG. 14 is a diagram showing a second modification of the sensor deviceaccording to the second embodiment.

FIG. 15A is a front view and FIG. 15B is a back view of the sensordevice according to a third embodiment.

FIG. 16A is a diagram showing a state before a probe is brought intocontact with a test-write terminal. FIG. 16B is a diagram showing astate in which the probe is brought into contact with the test-writeterminal.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

First Embodiment

Hereinafter, a sensor device according to the invention will now bedescribed in detail with reference to accompanying drawings. In theembodiments below, though a gyro sensor device will be described as anexample of the sensor device of the invention, the sensor device is notlimited to this. FIG. 1A is a front view and FIG. 1B is a back view ofthe sensor device. FIG. 2A is a right side view and FIG. 2B is a bottomview of the sensor device.

A sensor device 100 according to the present embodiment mainly includesa gyro sensor 10 serving as a sensor component, mounting leads 54 (54 ato 54 j), and a resin part 70.

As shown in FIG. 3A, the gyro sensor 10 mainly includes a crystal quartzresonator element 12, a support substrate 30, an IC 38, a package 40,and a lid 46. FIG. 3A is a sectional view and FIG. 3B is a bottom viewof the gyro sensor. The crystal quartz resonator element 12 serves as asensor element for detecting an angular velocity. The configuration ofthe crystal quartz resonator element 12 according to the embodiment isspecifically shown in FIG. 4.

The crystal quartz resonator element 12 includes a base part 14, a pairof detection arms 16 a and 16 b extended from the base part 14,connection parts 20 extended in a direction orthogonal to the detectionarms 16 a and 16 b from the base part 14, two pairs of driving arms 22 ato 22 d extended from the end of each of the connection parts 20 so asto be parallel to the detection arms 16 a and 16 b. In the crystalquartz resonator element 12 shown in FIG. 4, weighted parts 18 a, 18 b,and 24 a to 24 d are respectively provided to the end of each of thedetection arms 16 a and 16 b as well as the end of each of the drivingarms 22 a to 22 d. A detection electrode (not shown) and a drivingelectrode (not shown), which serve as an excitation electrode, arerespectively formed on the detection arms 16 a and 16 b as well as thedriving arms 22 a to 22 d, and the electrodes are coupled to aninput-output electrode (now shown) formed on the base part 14. Here, thedetection arms 16 a and 16 b and the driving arms 22 a to 22 d may havea so-called an H-shaped section. In this way, the flexibility of thearms is improved, increasing the detection sensitivity.

The support substrate 30 supports the crystal quartz resonator element12 in a state of being suspended from a bottom surface 41 of the package40 described in detail below or a step part 43. As shown in FIG. 5, thesupport substrate 30 is a TAB substrate that includes wires 36 (36 a to36 f) and a resin film 32 for covering the wires 36. The wires 36 are aconductive wire having flexibility. Provided to the resin film 32 aroundthe center of the support substrate 30 is an opening 34, so that thewires 36 are exposed. The wires 36 located at the opening 34 are curvedso as to be lifted up in a side, to which the crystal quartz resonatorelement 12 is provided, with respect to the main surface of the supportsubstrate 30 so that the crystal quartz resonator element 12 issupported in a state of being suspended. Here, the end (one end) of eachof the offset wires 36 serves as a connection terminal coupled to aninput-output terminal of the crystal quartz resonator element 12.Further, the other end of the wire 36 serves as a connection terminalcoupled to an internal connection terminal 42 a provided to the steppart 43 of the package 40.

The IC 38 is an integrated circuit for controlling the driving arms 22 ato 22 d while detecting signals obtained by the detection arms 16 a and16 b. The IC 38 is mounted on the bottom surface 41 of the package withan adhesive or the like. A connection pad (not shown) formed on theactive surface is electrically coupled to an internal connectionterminal 42 b provided on the bottom surface 41 of the package 40 via ametal wire 45.

The package 40 is a box for housing the crystal quartz resonator element12, the support substrate 30, and the IC 38 described above. A step-likerecess is formed inside the package 40. It is preferable that thepackage 40 is formed of ceramics or that like that have an insulationproperty.

The internal connection terminals 42 a and 42 b are provided to thebottom surface 41 and the step part 43 of the package 40 so as to mountthe above-described support substrate 30 and the IC 38. To the externalbottom surface (back side) of the package 40, connection terminals 44 ato 44 j are provided that are respectively electrically coupled tomounting leads 54 a to 54 j described below. Here, the internalconnection terminals 42 a and 42 b are electrically coupled to theconnection terminals 44 a to 44 j via a through hole or the like (notshown).

The lid 46 seals the opening of the package 40. The lid 46 generally isa flat plate of metal (an alloy, e.g., kovar) that has a close linearexpansion coefficient with the package 40, or a flat plate of glass(e.g., soda glass). In a case where the lid 46 is formed of metal, thepackage 40 is bonded to the lid 46 with low-melting-point metal as acoupling member 47. On the other hand, in a case where the lid 46 ismade of glass, low-melting-point glass is used as the coupling member47.

The above-described gyro sensor 10 includes the IC 38 mounted on thebottom surface 41 of the package 40, and the IC 38 and the internalconnection terminal 42 b are wire-bonded. The crystal quartz resonatorelement 12 is mounted on the support substrate 30, and the supportsubstrate 30 is mounted on the step part 43 of the package 40. Thesupport substrate 30 is mounted to the package 40 with a conductiveadhesive or a bump. After mounting the support substrate 30, the lid 46is bonded to the opening of the package 40. The bonding of the lid 46 iscarried out in a vacuum atmosphere, so that the inner space of thepackage 40 is evacuated to vacuum. In this way, the crystal quartzresonator element 12 is not hindered from being excited.

The mounting leads 54 a to 54 j set and maintain an angle θ formed by amounting surface (a surface that includes a part where the mountingleads 54 a to 54 j come into contact with the top surface of themounting substrate) and a terminal forming surface of the gyro sensor 10(refer to FIGS. 11A and 11B: FIG. 11A shows a case where the angle θ is0° and FIG. 11B shows a case where the angle θ is 90°). The mountingleads 54 a to 54 j also electrically couple the gyro sensor 10 with themounting surface. The mounting leads 54 a to 54 j according to theembodiment are formed by bonding the gyro sensor 10 to a lead frame unitshown in FIG. 6, forming, cutting, and curving a resin part 70 describedin detail below. In a case where the angle θ is larger, the position ofa gravity center G is higher, so that the mounting state becomesunstable. However, by mounting the gyro sensor 10 with the mountingleads 54 a to 54 j, the mounting area can be increased, and thestability of the mounting state can be achieved.

The lead frame unit 50 includes the mounting leads 54 a to 54 j, a diepad 52, and a frame 66. Each of the mounting leads 54 a to 54 j includesa one-end part 56, an other-end part 58, and an intermediate part 60.The one-end part 56 is a connection part coupled to one of theconnection terminals 44 a to 44 j of the gyro sensor 10. The other-endpart 58 serves as a mounting terminal of a gyro sensor device 100. Theintermediate part 60 is located between the one-end part 56 and theother-end part 58. The intermediate part 60 determines the angle θ formounting the gyro sensor 10. In the embodiment, an angled part 62 isformed such that an extending direction of the one-end part 56 and thatof the other-end part 58 makes 90°. In the lead frame unit 50 accordingto the embodiment, the end side of the other-end part 58 is coupled tothe frame 66, and the mounting leads 54 a to 54 j are integrally formedwith the frame 66.

The die pad 52 serves as a base when the one-end parts 56 arerespectively electrically coupled to the connection terminals 44 a to 44j of the gyro sensor 10. The die pad 52 is a metal plate provided so asto connect the upper side and the lower side of the frame 66.

The frame 66 is a frame member provided to the periphery of the mountingleads 54 a to 54 j and the die pad 52, and tying the mounting leads 54 ato 54 j and the die pad 52 together as an integral unit. The frame 66and the mounting leads 54 a to 54 j as well as the frame 66 and the diepad 52 are cut off after the formation of the resin part 70, andrespectively serve as an independent component.

The die pad 52 and the mounting leads 54 a to 54 j are bonded to thegyro sensor 10 with an adhesive. The die pad 52 and the like may bebonded to the gyro sensor 10 with a conductive adhesive. Between theone-end part 56 and each of the connection terminals 44 a to 44 j areelectrically coupled with a metal wire 69 formed by a wire bondingmethod so that a main surface of the one-end part and a main surface ofthe connection terminal face each other. Here, between the one-end part56 and each of the connection terminals 44 a to 44 j may be electricallyand mechanically coupled with a conductive connection member such assolder and a conductive adhesive.

The resin part 70 covers the die pad 52 and the gyro sensor 10 bonded tothe mounting leads 54 a to 54 j so as to ensure the airtight propertyand protect the connection part. The resin part 70 is formed of athermoplastic resin. The mounting leads 54 a to 54 j outwardly protrudefrom the resin part 70.

The gyro sensor device 100 according to the embodiment includes firstand second bent parts 64 and 68 in each of the mounting leads 54 a to 54j outwardly protruded from the resin part 70. The first bent part 64 isprovided between the one-end part 56 and the intermediate part 60. Thesecond bent part 68 is provided between the other-end part 58 and theintermediate part 60. Both of the first and second bent parts 64 and 68are bent along the resin part 70. The tilt of the gyro sensor 10 in thegyro sensor device 100 is determined by a planar shape of theintermediate part 60. Thus, the tile of the gyro sensor 10 is hardlyinfluenced by the bending angles of the first and second bent parts 64and 68. In the embodiment, the first and second bent parts 64 and 68both have a bending angle of approximately 90°.

According to the gyro sensor device 100 having such a configuration,even if the angle θ formed by the terminal forming surface (a firstsurface) of the gyro sensor 10 and the mounting surface (a secondsurface) of the gyro sensor device 100 is 90°, the arrangement of themounting leads 54 a to 54 j, i.e., the bending angle does not becomecomplex.

In addition, in the gyro sensor device 100, one main surface and theother main surface of the connection part, which is the one-end part 56of each of the mounting leads 54 a to 54 j, are provided substantiallyperpendicular to the mounting surface of the gyro sensor device 100, andeach first bend part 64 is formed by being folded at a linesubstantially perpendicular to the mounting surface. Accordingly, evenif a variation is produced in the bending angle of the first bent part64, the lowermost end of the mounting terminal, which is the other-endpart 58, in other wards a part of the mounting terminal that comes intocontact with a mounting pattern of the mounting substrate, moves withina surface parallel to the top surface of the mounting substrate.Accordingly, since it is possible to eliminate the influence on theangle θ due to the variation in the bending angle at the bend part 64 ofeach mounting lead, the angle θ can be defined with high accuracy.

The first and second surfaces are provided so as to have a predeterminedangle by determining a shape of the intermediate part, so that it can beachieved without the dedicated base substrate. As a matter of course,the dedicated base substrate and the like that are tailored for fixingthe gyro sensor 10 at the side surface are unnecessary, allowing themanufacturing cost to be reduced.

A process for manufacturing the gyro sensor 100 will be described. Anadhesive (now shown) is applied to the die pad 52 of the lead frame unit50 or the die pad 52 and each one-end part 56 shown in FIG. 6. The gyrosensor is bonded to the lead frame unit 50 while the terminal formingsurface faces the lead frame unit 50 to which the adhesive is applied(refer to FIG. 7). At this time, each one-end part 56 of the mountingleads 54 a to 54 j is provided such that a main surface thereof comesinto contact with and faces a main surface of the correspondingconnection terminals 44 a to 44 j. As a result, it is possible to stablymount the gyro sensor 10 on the lead frame unit 50.

The connection terminals 44 a to 44 j of the gyro sensor 10 whoseterminal forming surface is bonded to the lead frame unit 50 arerespectively coupled to the one-end part 56 of the mounting leads 54 ato 54 j with the metal wire 69, achieving electrical connection betweenthe connection terminals 44 a to 44 j and the mounting leads 54 a to 54j (refer to FIG. 8).

The gyro sensor 10 bonded to the mounting leads 54 a to 54 j as above isbuilt into a die 72 used for a molding process. The die 72 includes anupper die 72 a and a lower die 72 b. A resin, which is heated to bemelted (not shown), is pressed-fit into the die 72 into which the gyrosensor 10 is built, so that the outer shape of the resin part 70 isformed (refer to FIG. 9).

After the resin pressed-fit into the die 72 is hardened, the gyro sensor10 covered by the resin part 70 is taken out. In the gyro sensor 10taken out from the die 72, the mounting leads 54 a to 54 j and the diepad 52 are cut off from the frame 66 at the point indicated by thedashed lines in FIG. 10. Accordingly, the mounting leads 54 a to 54 jand the die pad 52 respectively serve as an independent component.

Each of the mounting leads 54 a to 54 j, which is cut off, is folded tothe bonding surface side of the gyro sensor 10 (e.g., the one mainsurface side) along the resin part 70, forming the first bent part 64.Each of the mounting leads 54 a to 54 j, which is in a state ofprotruding the other-end part 58 to the lower surface side of the resinpart 70 by the formation of the first bent part 64, is folded to thelower surface side of the resin part 70, forming the second bent part68.

First Modification

A first modification of the sensor device according to the firstembodiment will be described with reference to FIG. 12. In a gyro sensordevice 100 a according to the present modification, the first bent part64 of the mounting leads 54 a to 54 j protruded from the resin part 70is bent differently from that of the above-described first embodiment.

In other wards, in the gyro sensor device 100 according to the firstembodiment, each first bent part 64 is folded to the direction along theresin part 70 (the one main surface side of the mounting leads 54 a to54 j). On the other hand, in the gyro sensor device 100 a according tothe modification, the first bent parts 64 of the mounting leads 54adjacent to each other is alternatively folded to the one main surfaceside and the other main surface side. This allows increasing a spacebetween the mounting terminals (the other-end parts 58 of the mountingleads) adjacent to each other, thereby reducing the risk ofshort-circuit and the like when the sensor device is mounted on themounting substrate. Further, the large area of the mounting surface canbe ensured, improving the mounting stability. Furthermore, the gyrosensor 10 is located around the center of the gyro sensor device 100 a,increasing the stability in the placed state.

Here, other configurations, functions, effects, and the like are thesame as those of the gyro sensor device 100 according to the firstembodiment.

Second Embodiment

A second embodiment of the sensor device according to the invention willbe described with reference to FIG. 13. The configuration of the sensordevice according to the present embodiment is mostly the same as that ofthe sensor device according to the first embodiment described above.Thus, the same reference numerals are given to portions having the samefunctions as those in the first embodiment and thus descriptions thereofwill be omitted.

A gyro sensor device 100 b serving as a sensor device according to theembodiment and the gyro sensor device 100 serving as a sensor deviceaccording to the first embodiment differ in the configuration of eachintermediate part of the mounting lead 54 a to 54 j and theconfiguration of the resin part 70.

To be specific, in order to set the angle θ, the gyro sensor device 100according to the first embodiment includes the angled part 62 providedat each intermediate part of the mounting leads 54 a to 54 j. On theother hand, in a gyro sensor device 100 b according to the embodiment,the angled part 62 is not provided. Instead, the gyro sensor device 100b includes the intermediate part 60 having an arc shape in a planer viewso as to ensure the angle θ.

In a case where the mounting leads 54 a to 54 j have such aconfiguration, the angle θ can be freely changed by a length of theintermediate part 60, i.e., a position of the second bent part 68.Accordingly, design change and the like of the lead frame unit due tothe configuration of the angle θ are not necessary, allowing themanufacturing cost to be reduced. In addition, the same lead frame unitcan be used in various configurations, making the stock control easier.

Here, other configurations, functions, effects, and the like are thesame as those of the gyro sensor device 100 according to the firstembodiment.

Second Modification

A second modification of the sensor device according to the secondembodiment will be described with reference to FIG. 14. In a gyro sensordevice 100 c according to the present modification, each first bent part64 of the mounting leads 54 a to 54 j is bent in an opposite surfaceside (the other surface side) from the bonding surface (the one surface)of the gyro sensor 10. Even with this configuration, the same effects asthe gyro sensor device 100 b according to the second embodiment can beobtained.

Third Embodiment

A third embodiment of the sensor device according to the invention willbe described with reference to FIGS. 15A and 15B.

FIG. 15A is a front view and FIG. 15B is a right side view of the sensordevice.

A sensor device 100 d according to the present embodiment includes thegyro sensor 10, a plurality of leads 318 a to 318 j, and a resin part370. The gyro sensor 10 includes the connection terminals 44 a to 44 jon the terminal forming surface of the outer surface thereof. Eachsurface of the gyro sensor 10 has a rectangular shape, and theconnection terminals 44 a to 44 j are formed along a pair of the sidesfacing each other in the terminal forming surface. An angular velocitydetection element that forms the gyro sensor, an IC for controllinginput-output signals, and the like (all not shown) are mounted insidethe package of the gyro sensor 10.

The plurality of leads 318 a to 318 j includes a first lead group 316 aand a second lead group 316 b. The leads 318 b to 318 d and 318 g to 318i, which belong to the first lead group 316 a, are formed by folding aconductive flat plate having a one-end part 320 a and a other-end part324 a. Each of the one-end parts 320 a is electrically coupled to one ofthe connection terminals 44 b to 44 d and 44 g to 44 i of the gyrosensor 10. The other-end part 324 a serves as a mounting terminal of thesensor device. An intermediate part 322 a is provided between eachone-end part 320 a and each other-end part 324 a. The intermediate part322 a in the sensor device 100 d according to the embodiment changes theextending direction of the leads that belong to the first lead group 316a, and an angled part 328 is provided to the intermediate part 322 a.The angled part 328 changes the extending direction of the flat plateextending toward the other-end part 324 a from the one-end part 320 a.

The first lead group 316 a is provided so as to extend toward theoutside of the package component from the pair of sides in the terminalforming surface while the one-end parts 320 are respectively coupled tothe connection terminals 44 b to 44 d and 44 g to 44 i. The leads 318 bto 318 d and 318 g to 318 i, which are extended, are exposed from theresin part 370 described in detail below. First and second bent parts325 and 326 are provided to each part exposed from the resin part 370.The first bent part 325 is located between the one-end part 320 a andthe intermediate part 322 a while the second bent part 326 is locatedbetween the intermediate part 322 a and the other-end part 324 a. Theintermediate part 322 a and the other-end part 324 a are provided alongthe resin part 370. With this configuration, the leads that belong tothe first lead group 316 a are in a state of wrapping the resin part370.

The leads 318 a, 318 e, 318 f, and 318 j, which belong to the secondlead group 316 b, are formed by folding a conductive flat plate having aone-end part 320 b and an other-end part 324 b. Each of the one-end part320 b is electrically coupled to one of the connection terminals 44 a,44 e, 44 f, and 44 j of the gyro sensor 10 so that a main surface ofeach of the one-end parts 320 b and a main surface of each connectionterminal 44 face each other. The other end part 324 b serves as atest-write terminal of the sensor device 100 d. In the same manner asthe leads forming the first lead group 316 a, each lead belonging to thesecond lead group 316 b has an intermediate part 322 b between theone-end part 320 b and the other-end part 324 b. In the sensor device100 d according to the embodiment, the one-end part 320 b side of theintermediate part 322 b is buried in the resin part 370 while theother-end part 324 b of the intermediate part 322 b is exposed from theresin part 370.

The second lead group 316 b is laid out between the connection terminals44 a to 44 j in two rows formed along the pair of sides in the terminalforming surface and extended toward outside the gyro sensor 10 from oneof the sides that intersects with the pair of sides in the terminalforming surface while each one-end part 320 b is coupled to theconnection terminals 44 a, 44 e, 44 f, and 44 j. At this time, eachintermediate part 322 b of the leads 318 b to 318 d and 318 g to 318 iis formed and provided so as not to be electrically coupled to otherleads of the leads 328 b to 318 d and 318 g to 318 i as well as theconnection terminals 44 b to 44 d and 44 g to 44 i. A first bent part330 is provided between each intermediate part 322 b and each other-endpart 324 b. A second bent part 332 for providing the one-end part 320 balong the resin part 370 is provided to each other-end part 324 b. Here,the first and second bent parts 330 and 332 may be provided so as toprovide a small space (a relief part 344) between the resin part 370 andeach other-end part 324 b of the leads forming the second lead group 316b. It is because when other-end part 324 b is used as a test-writeterminal, the other-end part 324 b bends in the resin part 370 side inaccordance with a contact of a test-write probe (refer to FIGS. 16A and16B: FIG. 16A shows a state before the contact of the probe and FIG. 16Bshows a state of being contacted by the probe.

This function prevents the end part of the probe from being worn off. Inaddition, even if displacement and the like are produced in thetest-write terminal by displacement and the like of the bending anglewhen the terminals are formed, it is possible to insert the test-writeprobe. As a result, contact failures can be prevented.

The resin part 370 protects the connection surface between theconnection terminals 44 a to 44 j and the leads 318 a to 318 j, andcovers the connection surface and the gyro sensor 10. The resin part 370includes a cutout part 342 for disposing the other-end part 324 b of thesecond lead group 316 b. The cutout part 342 is formed so as to berecessed with respect to the outline of the resin part. When the resinpart 370 of the sensor device 100 d, which is in the mounting state, isviewed from above, the other-end part 324 b serving as the test-writeterminal is hidden. Thus, each lower end of the other-end part 324 b ofthe leads that belong to the second lead group 316 b disposed to thecutout part 342 is located higher than each lower end of the other-endpart 324 a of the leads that belong to the first lead group 316 adisposed to the bottom surface side of the resin part 370.

With this configuration, when the sensor device 100 d is mounted on themounting substrate, the other-end part 324 b serving as the test-writeterminal is not exposed. As a result, it is possible to reduce the riskof the inadvertent contact of electrodes of other electronic componentsand the like. Further, a step is produced between the other-end part 324a serving as the mounting terminal and the other-end part 324 b servingas the test-write terminal, surely preventing short-circuitstherebetween. Since the other-end part 324 b is suspended from themounting surface, forming a patter on the mounting substrate formounting the other-end part 324 b is obviously unnecessary.

In the sensor device 100 d, the connection terminals 44 a to 44 j areelectrically coupled and physically fixed to the leads 318 a to 318 j,respectively, with a conductive adhesive or an adhesive and a metal wire(all not shown). The first and second bent parts 325 and 326 of theleads forming the first lead group 316 a and the first and second bentparts 330 and 322 of the leads forming the second lead group 316 b areformed after the formation of the resin part 370. The resin part 370 isformed by a molding process using a die.

A specific method for manufacturing the sensor device 100 d is asfollows. First, the leads 318 a to 318 j, which belong to the first leadgroup 316 a or the second lead group 316 b, are formed. The leads 318 ato 318 j, which are formed, are physically fixed and electricallycoupled to the gyro sensor 10 manufactured in different steps. The gyrosensor 10 to which the leads 318 a to 318 j are coupled is introducedinto the die and covered by a resin so as to form the resin part 370having a desired shape. Thereafter, the leads 318 a to 318 j, which formthe first lead group 316 a or the second lead group 316 b, are bent soas to form the first bent parts 325 and 330 as well as the second bentparts 326 and 332.

According to the sensor device 100 d having such a configuration, it ispossible to form the other-end part 324 a serving as a user terminal(the mounting terminal) and the other-end part 324 b serving as thetest-write terminal at different sides of the bottom surface of thesensor device 100 d. As a result, short-circuits between the mountingterminal and the test-write terminal can be prevented.

The leads 318 a, 318 e, 318 f, and 318 j, which form the second leadgroup 316 b, are laid out on the terminal forming surface of the gyrosensor 10, improving the mounting stability when the gyro sensor 10 ismounted on the leads 318 a to 318 j. Such mounting stability contributesto improve the detection accuracy in a sensor device in which avariation of an angle (a mounting angle) is problematic that is formedby a mounting substrate and a mounting surface of an element, such as anangular velocity sensor or an acceleration sensor, built into the gyrosensor 10.

In the above embodiment, each intermediate part 322 a of the leads thatbelong to the first lead group 316 a includes the angled part 328.Accordingly, the terminal forming surface of the gyro sensor 10 and themounting surface of the sensor device 100 d can be mounted at differentangles with respect to the mounting substrate. Meanwhile, the anglebetween the terminal forming surface and the mounting surface may beangled by forming the intermediate part 322 a in a fan shape in a planerview, i.e., by extending the intermediate part 322 a in an arc shape.With this configuration, it is possible to change the angle between theterminal forming surface and the mounting surface by a length of theintermediate part 322 a.

What is claimed is:
 1. A sensor device, comprising: a sensor componentincluding: a package; connection terminals including first connectionterminals on a terminal forming surface of the package; and a sensorelement that has a detection axis and is housed in the package; a resinpart covering the sensor component; and mounting leads, each of themounting leads including: a one-end part coupled to one of the firstconnection terminals in the resin part so that a main surface of theone-end part and a main surface of the one of the first connectionterminals face each other; an intermediate part extending toward amounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part, wherein thesensor component is tilted or orthogonal with respect to the mountingsurface, and the connection terminals are provided along one of thesides forming an outline of the terminal forming surface, the one of thesides being tilted or orthogonal with respect to the mounting surface,wherein the intermediate part includes an angled part.
 2. The sensordevice according to claim 1, wherein the terminal forming surface of thesensor component is orthogonal to the mounting surface of the sensordevice, and the connection terminals are provided along the one of thesides of the outline of the terminal forming surface, the one of thesides being orthogonal to the mounting surface.
 3. The sensor deviceaccording to claim 1, wherein each other-end part of the mounting leadsis bent to a side of the one main surface and a side of an other mainsurface of the mounting lead.
 4. The sensor device according to claim 3,wherein the other-end parts of the mounting leads adjacent to each otherare alternately bent toward the one main surface and the other mainsurface of the mounting lead.
 5. The sensor device according to claim 1,further comprising test-write leads, wherein the connection terminalsinclude second connection terminals, wherein each of the test-writeleads includes: a one-end part coupled to one of the second connectionterminals so that a main surface of the one-end part and a main surfaceof the second connection terminal face each other; an intermediate partthat is laid out on the terminal forming surface and externally extendsfrom the resin part so as to straddle a side adjacent to the one of thesides of the terminal forming surface; and an other-end part outwardlyexposed from the resin part.
 6. A sensor device, comprising: a sensorcomponent including: a package; connection terminals including firstconnection terminals on a terminal forming surface of the package; and asensor element that has a detection axis and is housed in the package; aresin part covering the sensor component; and mounting leads, each ofthe mounting leads including: a one-end part coupled to one of the firstconnection terminals in the resin part so that a main surface of theone-end part and a main surface of the one of the first connectionterminals face each other; an intermediate part extending toward amounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part, wherein thesensor component is tilted or orthogonal with respect to the mountingsurface, and the connection terminals are provided along one of thesides forming an outline of the terminal forming surface, the one of thesides being tilted or orthogonal with respect to the mounting surface,wherein a planar shape of the intermediate part is an arch shape.
 7. Thesensor device according to claim 6, wherein the terminal forming surfaceof the sensor component is orthogonal to the mounting surface of thesensor device, and the connection terminals are provided along the oneof the sides of the outline of the terminal forming surface, the one ofthe sides being orthogonal to the mounting surface.
 8. The sensor deviceaccording to claim 6, wherein each other-end part of the mounting leadsis bent to a side of the one main surface and a side of the other mainsurface of the mounting lead.
 9. The sensor device according to claim 6,wherein the other-end parts of the mounting leads adjacent to each otherare alternately bent toward the one main surface and the other mainsurface of the mounting lead.
 10. The sensor device according to claim6, further comprising test-write leads, wherein the connection terminalsinclude second connection terminals, wherein each of the test-writeleads includes: a one-end part coupled to one of the second connectionterminals so that a main surface of the one-end part and a main surfaceof the second connection terminal face each other; an intermediate partthat is laid out on the terminal forming surface and externally extendsfrom the resin part so as to straddle a side adjacent to the one of thesides of the terminal forming surface; and an other-end part outwardlyexposed from the resin part.